Oza kungena ezihlangwini ze-Qualcomm's Snapdragon 845 iya kuqalisa imveliso yobuninzi kwikota ezayo yonyaka, ngokweengxelo zamva nje. Oku kuthetha ukuba i-TSCM, inkampani ye-semiconductor yaseTaiwan ephethe ukuveliswa kwayo, iya kusungulwa ngo-Okthobha ozayo.
Nangona kwiintsuku ezimbalwa ezidlulileyo siye saxela ukuba i-chipset iya kuveliswa ngeli xesha likhankanywe ngasentla, ngoku I-Arhente yeNdaba ePhakathi yaseTaiwan iyakungqina oko, ngoko ke ukwenziwa kwayo okukhulu kusemthethweni kunangaphambili kwaye ukungena kweprosesa kwimarike kusondele kwaye kusondele kakhulu.
Yonke into ilungile kwaye icwangcisiwe ukuze ukuveliswa ngobuninzi kuqale kwikota yesine kunye neyokugqibela yonyaka (Oktobha, Novemba noDisemba). Umda wexesha obekiweyo uyangqinelana nokubhengezwa kweQualcomm yamva nje malunga nenkqubo yayo ezayo kwi-chip. Inkampani yaseMelika, kwezi ntsuku zidlulileyo, ibhengeze ukuba sele ikwinqanaba lesampulu kwangoko kule nyanga, kwaye abavelisi abaninzi be-smartphone sele beneeprototypes abazivavanyayo ngoku.
I-chipset iya kwakhiwa phantsi kwenkqubo yokwenziwa kwe-TSCM entsha ye-7nm kwaye, ngokwengxelo yangaphambili yi-CEO yefem, CC Wei, i-SoC yaqala ukuveliswa kwiibhetshi ezincinci kwikota yesibini yalo nyaka ngendlela evaliweyo. Oku ukwenza iimvavanyo ezifanelekileyo kunye nohlengahlengiso kuyo. Ukongeza, kwaxelwa ukuba ulindelo lwenkampani luphezulu kakhulu, njengoko ilindele i-Snapdragon 855 - mhlawumbi ebizwa ngokuba - ukumela ukuya kuthi ga kwi-20% yengeniso kunyaka ozayo.
Fumana: I-Kirin 980 iya kuqalisa ukuthumela ngekota elandelayo
Iingxelo nazo zibonisa ukuba I-TSMC iza kuhlala iyi-chipmaker ye-Apple ngo-2019, njengoko inkampani ikhusele ii-odolo zochungechunge lwe-iPhone lonyaka ozayo. Kwaye kwatyhilwa ukuba umenzi we-semiconductor waseTaiwan uthathe ii-odolo ze-7nm System-on-Chips ukusuka kwi-AMD, ngaloo ndlela isusa i-GlobalFoundries, umthengisi oqhelekileyo kunye nokhoyo ngoku weprosesa zolu phawu.