Kanye emva kokuba i-chipmaker yaseTaiwan i-TSMC ibhengeze ukuba iya kuba neeprosesa ze-5nm ezilungile kulo nyaka uzayo, ngoku Inkampani ibhengeze ukuba iqalile ukuvelisa ngobuninzi inkqubo yayo yesibini ye-7nm +.
Inkqubo ye-7nm+ ithatha indawo kubuchwephesha be-7nm obusetyenziswa kwii-chipsets zangoku ezifana ne-Kirin 980, i-Bionic A12 kunye ne- Snapdragon 855.
Inkampani isebenzisa ifayile ye- I-lithograph ye-EUV okokuqala kwimveliso. Oku kuyinkimbinkimbi ngakumbi kwaye kuhambile kunangoku okusetyenziswayo kwiiprosesa zokusebenza okuphezulu. (Fumanisa: Iiprosesa eziqhuba kakuhle kwii-smartphones, ngokwe-Master Lu)
Inkqubo ye-7nm + iya kusetyenziswa kwisizukulwana esilandelayo se-Apple A13 chipset, kunye neHuawei's Kirin 985, eya kwaziswa kamva kulo nyaka, njenge-Apple. Inokuthi iphunyezwe kwindlalifa ye-Qualcomm ye-SD855 yangoku.
Kuphuhliso lwakutsha nje, iingxelo ezininzi zibanga oko I-TSMC iya kuqhubeka nokubonelela ngeenxalenye zeHuawei zeKirin 985 ezayo ukuba isetyenziswe kwi Umlingani 30 nakwezi flegi zilandelayo, abalandela le ifemu yase China. Oku kuqinisekisiwe, phakathi koxinzelelo oluphuma kurhulumente wase-United States koogxa babo ukuba bayeke itekhnoloji yeHuawei.
Kwelinye icala, njengoko sijonge ekuqaleni, Inkampani ikwaqalisile ukuveliswa kwenkqubo ye-5nm ye-SoCs ngetekhnoloji ye-EUV.. Imveliso yobuninzi kulindeleke ukuba iqale kwi-Q2020 5, ke phakathi kunyaka olandelayo kufanele ukuba siqale ukubona i-2020nm TSMC chipsets kwintengiso, malunga noJuni XNUMX.
Enkosi kwezi ntshukumo, kuyacaca ukuba ifemi yaseTaiwan iceba ukuqhubeka nokuhlala ingoyena ndoqo onokukhetha phakathi kwabavelisi bechipset ukuphuhlisa iiprosesa zayo zee-smartphones. IQualcomm, iHuawei kunye neApple zintathu zazo.