Hisense luphawu olwamkelweyo liphela lokwenziwa kweethelevishini kunye nezixhobo zasendlini, nangona ibitsala umdla amaxesha ngamaxesha ngokunikezelwa kwefowuni engaqhelekanga. Enye yezinto ezothusayo I-HiSense King Kong 6, i-terminal ene-5.500 mAh ibhetri kunye nebhetri engaphezulu kwe-4.500 mAh.
Inkampani isebenzise inethiwekhi ye-Weibo ukubonisa i-smartphone entsha eya kubhengezwa kuyo NgoMvulo, Epreli 20 kumsitho okwi-intanethi. Oku kubizwa I-HiSense F50 5G, iba yeyokuqala ngokudibanisa isizukulwana sesihlanu ngokudibanisa i-Unisoc chip.
I-HiSense F50 5G Iinkcukacha zokuqala
Zimbalwa iimpawu ezivezwe yinkampani yaseTshayina, phakathi kwazo ezo uza kufaka iprosesa ye-Unisoc T7510 ngeChun Teng V510 band kwaye ixhasa i5G. Le CPU iboniswe kwi-Mobile World Congress 2019 e-Barcelona kwaye ngoku idityaniswe kwifowuni entsha eza kukhutshwa ukuphela kuka-Epreli.
I-Unisoc T7510 sisiseko esibhozo se-SoC Nge-4x Cortex-A75 2,0 GHz kunye ne-4x A55 1,8 GHz, i-GPU yi-PowerVR GM9446 kwaye ine-NPU emibini. Le chip ibonelela ngoqhagamshelo lweWi-Fi 5 (ac), iBluetooth 5.0 kunye nelinye igalelo yiNFC edibeneyo.
I-Hisense F50 5G iya kuba nebhetri ebalulekileyo ye-5.010 mAh ngo-18W ukutshaja ngokukhawuleza kwaye unokhetho lokupholisa ukuze ukwazi ukulungelelanisa ngalo naliphi na ixesha. I-F50 5G ibonisa ikhamera ye-quad emfanekisweni, kodwa abanikanga iinkcukacha zesenzi esifakwe kwifowuni.
Iyakubhengezwa ngalo Mvulo
I-HiSense F50 5G ihlehliselwe uMvulo lusuku olukhethelwe umboniso osemthethweni, nangona yonke into ibonisa ukuba ayizukuphela kwayo yinkampani yaseAsia. I-HiSense iya kunika iinkcukacha ezithe kratya kunye nethegi yexabiso malunga neentsuku ezine.