Samsung ipanga chip cha Snapdragon 820

Snapdragon 820

Pamene tinali ndi woyamba bechmarking ya chipangizo cha Snapdragon 820 komanso nkhani zosiyanasiyana zokhudzana ndi mafoni omwe aziphatikizira m'matumbo awo, tidatha kuzindikira kuti chaka chino inde izo Icho chikanakhala chimodzi kuchokera kubwerera kwa Qualcomm kuti apereke ukadaulo wawo wapamwamba pama tchipisi tambala. Mbiri yolembera chip yomwe yawonetsa mphamvu yayikulu yamagetsi, luso lapamwamba kwambiri ndi zomwe zingakhale mphamvu zowirikiza pakuwunika kwamitundu yonse yomwe ingathandize kuti ichite bwino pama foni aliwonse omwe ibwera chaka chonsechi.

Samsung yatsimikizira lero kuti yayamba kupanga kwa mbadwo wachiwiri Zaukadaulo wa 14nm FinFET. Nkhaniyi ili ndi chitsimikizo kuti purosesa ya Qualcomm yomwe ikubwera ya Snapdragon 820 itengera ukadaulo uwu kuti uigwiritse ntchito Low-Power Plus (LPP) zomwe zimapangitsa kuti magwiridwe antchito azigwiranso bwino komanso kugwiritsa ntchito bwino mphamvu. mphamvu yochuluka ya batri. Mwachidule, izi zitilola kuti tizitha kugwiritsa ntchito mapulogalamu omwe ali ndi kuthekera kwakukulu komanso masewera apakanema omwe akukweza gawo lomwe tazolowera.

Snapdragon 820 yokhala ndi LPP

Kuphatikizidwa kwaukadaulo wa 14nm FinFET kumatanthauza kuti chip cha Snapdragon 820 chili ndi LPP (Low Power Plus). Kulankhula momveka bwino, izi zidzalola chip kuyendetsa liwiro la 15% mwachangu amawononga 15 peresenti yocheperako moyo wabatire poyerekeza ndi tchipisi tomwe Samsung imagwiritsa ntchito ndiukadaulo wa 14nm FinFET.

Snapdragon 820

Ndi nkhani iyi tinene kuti Samsung ndi Qualcomm apanga zisankho, ngakhale sanatsimikizire ngati Snapdragon 820 yatsopanoyi iphatikizidwa kale mufoni zatsopano za Samsung, kuphatikiza Galaxy S7. Tanena kale maulendo angapo kuti S7 iyi ipezeka bwanji ku Mobile World Congress ku Barcelona mwezi wamawa komanso kuti mwazinthu zina zofunikira kwambiri idawoneka ngati chip ichi.

Mgwirizano pakupanga chip, sizikutanthauza kuti Samsung adzaigwiritsa ntchito pa Galaxy S7, atero a Patrick Moorhead, Purezidenti komanso wofufuza wamkulu ku Moor Insights & Strategy. Moorhead ananenetsa kuti Samsung imagwira ntchito pama mobile ndi semiconductors mosiyana, chifukwa chake sikuyenera kukhala lingaliro loti imagwiritsa ntchito chip ichi chifukwa choti chimapanga.

Qualcomm kubwerera ku bizinesi ndi Samsung

Chifukwa cha zovuta zazikulu pakuwunikanso koyamba kwa Snapdragon 810, Qualcomm idataya ma contract angapo mu bizinesi ndi Samsung pomwe idaganiza zogwiritsa ntchito Exynos yake m'malo mwa SoC yovuta m'mbali mwake ya Galaxy S6 ndi S6. Qualcomm idadabwitsidwa ndi kutha kwa kuphatikizika kwa tchipisi chake kumapeto kwa wopanga waku Korea, lingaliro lotengedwa bwino ndi Samsung ndipo zidapangitsa kuti mafoni ake asapeze mavuto otentha omwe HTC One M9 idakhala nawo.

Exynos

Koma kubwerera ku mwayi wake ndi chip yabwino kwambiri mu 820 kumulola kuti abwerere ku Samsung kuti akaphatikizire tchipisi chake ndikuwonetsa momwe amadziwira bwino kuchita zinthu. Kuphatikiza apo, ili ndi mwayi wopereka mtundu wapamwamba komanso mphamvu ndi chip ichi chomwe chingalole Samsung khalani ndi Galaxy S7 yokhala ndi mawonekedwe abwinoko kuti apikisane kwambiri ndi Apple.

Tidzawona Qualcomm SoC yatsopano mu LG G5, Xiaomi Mi 5 ndi ena ambiri omwe akuyembekezera kuti akhazikitsidwe kuti awonetse kuthekera kwawo kwakukulu. Ndayankhapo kale munthawi zosiyanasiyana momwe LG yokha yakwanitsira kuchepetsa mphamvu batire ya flagship yake yotsatira kuti mupeze mphamvu zamagetsi zomwe mumapeza kuchokera ku 820. Tiyeneranso kudziwa kuti kusintha kwa magwiridwe antchito kulinso chifukwa cha mawonekedwe akulu a Marshmallow ndi dongosolo la doze.


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